Process chamber
The reaction chambers produced by our company, leveraging precision manufacturing technology, special coating technology, and cleaning technology, have gained favor with major domestic and international clients, with product performance meeting customer process requirements.
Currently manufactured reaction chambers are used in Etch, PVD, RTP, EPI, ALD equipment, etc.
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Product Characteristics
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Product Parameters
Product Characteristics
High Precision
High precision equipment parts are fundamental for semiconductor chip manufacturing, especially at the nanometer scale. Component precision directly determines the accuracy of wafer processing equipment and the implementation of its various process functions.
High Cleanliness
High-cleanliness equipment components are fundamental for achieving high yield rates in wafer processing. The cleanliness of process equipment directly determines the yield rate of wafers in process and subsequent chips, even determining if an entire production line can produce qualified products.
High Corrosion Resistance
Highly corrosion-resistant equipment components are a functional requirement for chip manufacturing equipment. The corrosion resistance of parts determines the equipment's functionality, reliability, and the frequency of online downtime for maintenance.
Product Parameters
| Material: | Aluminum Alloy / Stainless Steel |
| Surface Treatment: | Anodization, Electroless Nickel Plating, Coating, Precision Cleaning |
